Congatec 050503 (conga-TCV2/V2516) is a high-performance embedded computing module designed for industrial, IoT, and edge AI applications. – Processor: AMD Ryzen Embedded V2516 (Zen 2 architecture). – Graphics: Integrated AMD Vega GPU.
No any handle fees.
Qty 2. The HP Agilent MSA-0485 Cascadable MMIC RF Amplifier is a high-quality integrated circuit designed for RF amplification in the DC-3.6GHz frequency range. With a 50 Ohm impedance, this amplifier is ideal for various industrial and business applications requiring precise and reliable signal amplification. The cascadable design allows for easy stacking and matching of multiple amplifiers for even greater performance. Trusted for its brand reputation and expertise in electrical equipment, HP Agilent is a top choice for those seeking superior RF amplification solutions.
ESPESSURAS – 0,43mm e 0,50mm
PESO – 0,43mm (3,90 kg/m²)
0,50mm (4,50 kg/m²)
LARGURA – 1.050 mm
TELHA + TELHA EPS 30mm + TELHA
ESPESSURAS – 0,43mm e 0,50mm
PESO – 0,43mm (3,90 kg/m²)
0,50mm (4,50 kg/m²)
LARGURA – 1.050 mm
TELHA + TELHA EPS 30mm
ESPESSURAS – 0,43mm e 0,50mm
PESO – 0,43mm (3,90 kg/m²)
0,50mm (4,50 kg/m²)
LARGURA – 1.050 mm
TELHA + TELHA EPS 30mm
ESPESSURAS – 0,43mm e 0,50mm
PESO – 0,43mm (3,90 kg/m²)
0,50mm (4,50 kg/m²)
LARGURA – 1.050 mm
TELHA + TELHA EPS 30mm + FILME ACARTONADO
ESPESSURAS – 0,43mm e 0,50mm
PESO – 0,43mm (3,90 kg/m²)
0,50mm (4,50 kg/m²)
LARGURA – 1.050 mm
ESPESSURAS – 0,43mm e 0,50mm
PESO – 0,43mm (3,90 kg/m²)
0,50mm (4,50 kg/m²)
LARGURA – 1.050 mm
ESPESSURAS – 0,43mm e 0,50mm
DIMENSÕES – 1.250 mm X 2.000 mm
1.250 mm X 3.000 mm
ESPESSURAS – 0,43mm e 0,50mm
DIMENSÕES – 1.250 mm X 2.000 mm
1.250 mm X 3.000 mm
ESPESSURAS – 0,43mm e 0,50mm
DIMENSÕES – 200 / 300 / 350 / 400 / 500 / 600 / 800 / 900 / 1.200
COMPRIMENTOS – 42m / 84m
